Processors

Lenovo Xeon Intel Gold 6342. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Lenovo Intel Xeon Silver 4116. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR650

AMD Opteron Dual-core 8220 SE. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron Dual-Core 8220. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

Intel Xeon E7420. Processor family: Intel® Xeon® E7 Family, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 1900 M, Processing Die size: 503 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm

Intel Xeon D-1567. Processor family: Intel® Xeon® D, Processor socket: BGA 1667, Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR3-SDRAM. Market segment: Server, PCI Express slots version: 2.0, 3.0, PCI Express configurations: 1x16, 1x4, 1x8. USB version: 2.0/3.2 Gen 1 (3.1 Gen 1). Intel® Turbo Boost Technology 2.0 frequency: 2.7 GHz

Intel Xeon W-2275. Processor family: Intel Xeon W, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 1S. Intel® Turbo Boost Max Technology 3.0 frequency: 4.8 GHz. Processor package size: 45mm x 52.5mm

AMD Opteron Dual-Core 8220. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

Lenovo AMD EPYC 7352. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor lithography: 7 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz

Intel Xeon w5-3425. Processor family: Intel Xeon W, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 4000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Use conditions: Workstation, Supported instruction sets: SSE4.1, AMX, SSE4.2, AVX 2.0, AVX-512. Intel® Turbo Boost Max Technology 3.0 frequency: 4.6 GHz, Intel® Turbo Boost Technology 2.0 frequency: 4.4 GHz. Processor package size: 77.5 x 56.5 mm

Cisco E5-2640V3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX. Processor package size: 52.5 mm

Lenovo Intel Xeon Gold 6246R. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Processor package size: 76 x 56.5 mm