Xeon

Intel Xeon W-3175X. Processor family: Intel® Xeon®, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 512 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 1S. Package width: 4.09" (104 mm), Package depth: 5.12" (130 mm), Package height: 1.77" (45 mm). Processor package size: 76mm x 56.5mm

Lenovo Intel Xeon Gold 6336Y. Processor family: Intel® Xeon®, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Package type: Retail box

Cisco Xeon E5-2695 v2 (30M Cache, 2.40 GHz). Processor family: Intel® Xeon® E5 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 x 51 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 786432 MB

Intel Xeon BX807133465X. Processor family: Intel Xeon W, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 4000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Use conditions: Workstation, Supported instruction sets: SSE4.1, AMX, SSE4.2, AVX 2.0, AVX-512. Intel® Turbo Boost Max Technology 3.0 frequency: 4.8 GHz, Intel® Turbo Boost Technology 2.0 frequency: 4.6 GHz. Package type: Retail box

Intel Xeon PK8071305081700. Processor family: Intel Xeon W, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 4000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Use conditions: Workstation, Supported instruction sets: SSE4.1, AMX, SSE4.2, AVX 2.0, AVX-512. Intel® Turbo Boost Max Technology 3.0 frequency: 4.8 GHz, Intel® Turbo Boost Technology 2.0 frequency: 4.6 GHz. Package type: Retail box

Cisco Xeon Gold 6128 (19.25M Cache, 3.40 GHz). Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, SSE4.2, Scalability: S4S. Processor package size: 76.0 x 56.5 mm. Maximum internal memory: 786432 MB

Intel Xeon Gold 6354. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Cisco Intel Xeon Gold 5318N. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Maximum internal memory: 6 TB

Cisco Intel Xeon Gold 5318N. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Maximum internal memory: 6 TB

Intel Xeon Gold 6434H. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 512 GB, Intel® Data Streaming Accelerator (DSA): 1 default devices, Intel® In-memory Analytics Accelerator (IAA): 1 default devices. Processor package size: 77.5 x 56.5 mm

HPE Xeon Gold 6312U. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 1S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon X7460. Processor family: Intel® Xeon® 7000 Sequence, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 1900 M, Processing Die size: 503 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm