Xeon

Lenovo Intel Xeon Bronze 3106. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR630

Intel Xeon E-2336. Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Package type: Retail box

Lenovo Xeon Silver 4314. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Lenovo Intel Xeon E5-2650 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Compatibility: HPE DL160 Gen9

HPE Intel Xeon E5-2640 v3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Compatibility: DL380 GEN9

Lenovo 4XG7A14812. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: ThinkSystem ST550

Intel Xeon E-2136. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package type: Retail box

Intel Xeon W-2223. Processor family: Intel Xeon W, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 1S. Package width: 1.73" (44 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm). Processor package size: 45mm x 52.5mm

Intel Xeon ® ® E-2336 Processor (12M Cache, 2.90 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Package type: Retail box

Intel Xeon E-2236. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon E-2136. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon E5-2609V4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 45mm x 52.5mm